Infineon CYBLE-022001-00 AIROC™ Bluetooth® LE Module Product Overview
The CYBLE-022001-00 is a fully integrated, fully certified Bluetooth® Low Energy (BLE) embedded module from Infineon Technologies’ AIROC™ series. Based on a proven hardware design and featuring an Infineon PSoC™ 4 MCU alongside the AIROC™ Bluetooth® LE solution, this module is a turnkey solution ready for immediate production.
The CYBLE-022001-00 integrates an on-board crystal oscillator, chip antenna, passive components and the PSoC™ 4 controller within a compact 10 mm × 10 mm × 1.80 mm SMT package, enabling full BLE wireless communication functionality without the need for external RF components. The module has been certified to meet regulations in multiple countries, including FCC, ISED, MIC and CE, significantly reducing time-to-market.
Key Features
The CYBLE-022001-00 module offers the following core features:
Bluetooth and Wireless Performance
Bluetooth Standard: Compatible with Bluetooth® Core Specification version 5.1; SIG-certified (QDID 141250, Declaration ID U048555)
RF Frequency: 2.4 GHz ISM band
Transmit Power: Adjustable from –18 dBm to +3 dBm
Receive Sensitivity: –87 dBm to –91 dBm
Data Rate: 1 Mbps
Communication Range: Up to 100 metres (Class 2)
Processor and Memory
CPU Core: ARM® Cortex®-M0, maximum operating frequency 48 MHz
Flash memory: 128 KB
SRAM: 16 KB
Peripherals and Interfaces
GPIO: Up to 16 configurable GPIO pins
Serial communication: I²C, SPI, UART (2 Serial Communication Blocks (SCBs))
ADC: 12-bit, 1 Msps SAR ADC with internal reference and channel sequencer
PWM: 4 x 16-bit TCPWM modules
Capacitive Sensing: Supports up to 15 CapSense® capacitive sensors
Programming Interface: Two-wire SWD (Serial Wire Debug)
Power Consumption and Power Supply
Supply Voltage: 1.8 V to 5.5 V
Low-Power Modes:
Deep Sleep: 1.3 μA (WCO enabled)
Hibernate: 150 nA (SRAM hold)
Stop: 60 nA (XRES wake-up)
Package and Temperature
Package dimensions: 10.0 mm × 10.0 mm × 1.80 mm (including shield)
Operating temperature range: –40 °C to +85 °C (industrial grade)
Technical Specifications Summary
Model: CYBLE-022001-00
Brand: Infineon (formerly Cypress)
Series: AIROC™ Bluetooth® Module
Bluetooth Version: 5.1 (compatible with 4.1)
Core Chip: PSoC™ 4 MCU + AIROC™ BLE
CPU ARM® Cortex®-M0 @ 48 MHz
Flash / SRAM: 128KB / 16KB
Transmit Power: 3dBm (maximum)
Receive Sensitivity: -87dBm to -91dBm
Interfaces: I²C, SPI, UART
GPIO: 16
Supply Voltage: 1.8V – 5.5V
Dimensions: 10×10×1.80 mm
Operating temperature: -40°C to +85°C
Certifications: FCC, CE, MIC, KC, IC, Bluetooth SIG
Applications
The CYBLE-022001-00 is suitable for a wide range of BLE wireless connectivity scenarios:
Health and lifestyle devices (wearables, medical monitoring)
Battery Energy Storage Systems (BESS)
Single-phase string inverters
Offline UPS (high-frequency transformers)
Space-constrained embedded applications
Industrial IoT sensors and controllers
Why choose the CYBLE-022001-00?
Turnkey solution: The module incorporates an oscillator, antenna, passive components and a BLE protocol stack, making it ready for use straight out of the box
Global Certifications: Complies with FCC, CE, MIC, KC, IC and Bluetooth SIG certifications, significantly reducing certification costs and time
Ultra-compact size: 10×10 mm package, suitable for space-constrained designs
Industrial-grade temperature range: -40°C to +85°C, suitable for harsh environments
Ultra-low power consumption: Multiple low-power modes, suitable for battery-powered devices
Extensive peripherals: Integrated ADC, PWM, CapSense®, serial communication and more, reducing the need for external components
About Mingjiada
Mingjiada has long been a supplier of genuine Infineon AIROC™ series Bluetooth® modules. The CYBLE-022001-00 is currently in ample stock; please feel free to enquire and place your order.
담당자: Mr. Sales Manager
전화 번호: 86-13410018555
팩스: 86-0755-83957753
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