회사 블로그 Qorvo AWMF-0247 Half-Duplex Ku-Band Quad Beamformer For LEO And NTN Terminals

Shenzhen Mingjiada Electronics Co., Ltd. supplies and recycles the Qorvo AWMF-0247 half-duplex Ku-band quad beamformer, suitable for low Earth orbit and non-ground network terminals.

I. AWMF-0247 Product Overview

The AWMF-0247 is a Ku-band 4-channel half-duplex beamformer IC (Quad 4×1 Tx/Rx Beamformer) launched by Qorvo for next-generation time-division duplex (TDD) satellite communications. It has been specifically developed for low Earth orbit satellite constellations and compact flat-panel phased array terminals for 5G non-terrestrial networks (NTN). The device utilises a highly integrated silicon-based architecture, integrating both the transmit and receive chains onto a single chip. It supports time-division transmission and reception using a shared antenna aperture, replacing traditional solutions with separate transmit and receive chips. This significantly reduces the size of the active antenna array, the number of components and the overall power consumption of the system, perfectly meeting the design requirements of mobile satellite terminals for lightweight, low-profile and low-power-consumption solutions.

The AWMF-0247 completes Qorvo’s Ku-band beamforming product portfolio, complementing the AWMF-0240 receive beamformer and AWMF-0241 transmit beamformer, and supports both FDD and TDD satellite terminal architectures, enabling mainstream NTN applications such as airborne, vehicle-mounted and ship-mounted portable satellite terminals, as well as IoT satellite gateways.

II. Key Electrical Specifications of the AWMF-0247

Operating Frequency Bands

Transmit (Tx): 13.75–14.5 GHz (Ku-band uplink)

Receive (Rx): 10.7–12.75 GHz (Ku-band downlink)

Channel Configuration: 4-channel fixed-polarisation antenna unit, half-duplex TDD time-division transmission and reception

Beam Control Accuracy

・6-bit phase control, minimum step size 5.625°

・6-bit gain control, minimum step size 0.25 dB

Built-in Features: On-chip temperature-dependent gain compensation, real-time chip temperature monitoring, idle port impedance optimisation

Package Type: FC-CSP (Wafer-Level Chip-Scale Package), miniaturised surface-mount design, suitable for high-density array PCB layouts

Compliance: Halogen-free, RoHS-compliant, not subject to ITAR restrictions, facilitating global supply for commercial satellite projects

III. Key Technical Advantages of the AWMF-0247

1. Integrated half-duplex transceiver architecture, simplifying AESA design

The single-chip integrated Tx/Rx links eliminate the need for separate transmit and receive boards in the array and support shared radiating elements in flat-panel antennas. Compared to discrete beamforming solutions, this reduces system BOM costs and simplifies wiring complexity, facilitating the mass production of ultra-thin, low-profile satellite terminals.

2. Leading energy efficiency, suited to the power constraints of mobile platforms

Power consumption of the receiving array is reduced by 40% compared to similar solutions, whilst the receive signal-to-noise ratio is improved by 20%; support for adjustable power amplifier bias increases linear transmission efficiency by up to five times. Faced with the limited power supply conditions of LEO mobile terminals and airborne equipment, this effectively alleviates thermal management pressures and extends terminal battery life.

3. Excellent aperture efficiency to meet high-speed satellite tracking requirements

An independent transmit/receive feed architecture, combined with optimised idle channel impedance, improves return loss in the off-state by >3 dB, thereby reducing channel crosstalk; high-precision phase and gain adjustment supports high-speed beam steering, making it suitable for scenarios involving high-speed LEO satellite overflights and continuous beam tracking.

4. Stable operation across a wide temperature range, suitable for harsh outdoor mobile environments

Integrated on-chip temperature sensing and automatic gain compensation suppress RF gain drift in high and low temperature environments, reducing the need for external array calibration and enhancing communication stability for maritime vessels, aircraft and field-deployed mobile terminals.

5. Highly scalable array solution

A single chip drives four array elements; by cascading multiple AWMF-0247 chips, active phased arrays of varying scales can be flexibly configured, enabling a wide range of EIRP coverage suitable for applications ranging from lightweight, portable terminals to medium-sized vehicle-mounted satellite gateways.

IV. Typical Application Scenarios for the AWMF-0247

Suitable for Low Earth Orbit (LEO) satellites and Non-Terrestrial Network (NTN) terminals

Ku-band flat-panel active phased array user terminals for LEO constellations (TDD architecture)

5G NTN integrated space-to-ground IoT satellite gateways

Low-profile satellite communication antennas for in-motion applications on aircraft, vehicles and vessels

Portable emergency satellite communication terminals and field-deployable mobile broadband satellite equipment

New low-cost commercial NGSO satellite ground receiving stations