회사 블로그 Recycle Lontium Interconnect Chips:High-Speed Signal Interconnect Chip,AI Interconnect Chip

Recycle Lontium Interconnect Chips:High-Speed Signal Interconnect Chip,AI Interconnect Chip

Shenzhen Mingjiada Electronics Co., Ltd., as a leading enterprise in the electronic component recycling industry, provides customers with comprehensive electronic component recycling solutions through professional services, highly competitive prices and a firm commitment to integrity.

Recycling Advantages:
1. Pricing and Financial Advantages
High-value recycling: Based on global market trends, we offer industry-leading quotes to maximise the value of our clients’ stock.
Prompt payment: Settlement is completed within 24–48 hours of inspection, with support for cash, wire transfers and multi-currency payments.
Strong financial standing: Ensures a smooth process for large-scale stock recycling, without the pressure of credit terms.

2. Professional Assessment and Quality Control
Experienced Team: Our team of engineers provides free inspection services, enabling rapid identification of part numbers, batch numbers, packaging types and quality conditions.
Transparent Pricing: We provide accurate quotations based on global market trends, scarcity, application scenarios and product condition.

3. Product Categories and Coverage
Comprehensive Coverage: 5G, new energy, automotive-grade, AI, storage, sensors, MCUs, communications ICs, wireless modules and more.
Wide Range of Applications: Industry, automotive, telecommunications, the Internet of Things (IoT), consumer electronics, satellite communications, and more.

4. Service and Transaction Advantages
Global Network: We have offices in Shenzhen, Hong Kong, Japan, Russia, Europe, the United States and Taiwan, providing global distribution services.
Flexible Transactions: Cash purchases, on-site collection, consignment, consignment arrangements, stock clearance and inventory management.
Efficient Process: Enquiry → Assessment → Quotation → Logistics → Inspection → Payment – standardised operations throughout the entire process.
One-Stop Service: Comprehensive handling of stock categorisation, inventory listing, quotations, logistics and distribution matters.

5. Security and Compliance
Legitimate Sources: We source exclusively from legitimate channels, such as manufacturers, distributors and traders, to ensure compliance.
Data Security: Standardised data destruction mechanisms protect clients’ commercial information and privacy.

Lontium relies on three core technologies: high-bandwidth SerDes, high-speed interface protocol processing, and audio and video signal processing. It has created two major interconnection product matrices: high-speed signal interconnect chips and AI interconnect chips (AI capacity chips). It builds end-to-end high-speed data paths, breaks down data transmission barriers between computing, storage, and display units, and provides domestically produced high-speed interconnection solutions for intelligent vision, automotive electronics, AR/VR, AI servers, and high-performance computing HPC scenarios.

I. High-speed signal interconnect chip
High-speed signal interconnect chips are core signal conditioning devices in high-speed links. Their products include repeaters, signal switchers, signal distributors, matrix switching chips, and other categories. Their core functions are to equalize and amplify high-speed serial signals, suppress jitter, recover clock data, and correct bit errors. They solve the signal attenuation and distortion problems caused by long PCB wiring and multi-node links, and ensure excellent signal integrity under high-bandwidth transmission.

core characteristics
1. Multi-protocol compatibility: Natively supports mainstream high-speed display interfaces such as HDMI, DP, MIPI, and USB4, with single-channel speeds up to 20Gbps. It can support 8K ultra-high-definition video transmission and is compatible with high refresh rate and variable refresh rate display systems.
2. Signal routing capability: Supports multiple signal inputs, output switching, and matrix allocation. A single chip completes multi-source signal scheduling, simplifies the overall hardware architecture, reduces the number of peripheral components, and lowers BOM costs.
3. Low latency and high fidelity: A dedicated signal purification link ensures lossless transmission of image signals without significant image delay, adapting to scenarios with stringent real-time requirements, such as AI vision terminals, AR/VR near-eye displays, and in-vehicle multi-screen cockpits.
4. Automotive-grade optional versions: Multiple models are AEC-Q100 certified and can withstand complex automotive environments such as wide temperatures and vibrations. They are used for in-vehicle domain controllers, in-vehicle multi-screen interconnection, and in-vehicle camera signal aggregation and transmission.

Typical application scenarios
Intelligent vision terminals, commercial display matrix systems, AR/VR/MR headsets, automotive intelligent cockpit multi-screen interconnection, industrial machine vision, and medical high-definition imaging equipment.

II. AI Interconnect Chips (AI Transport Capacity Chips)
AI interconnect chips designed for AI training, AI inference, and high-performance computing clusters are Longxun's core products for entering the AI & HPC field. They focus on large-capacity data exchange between GPUs, CPUs, memory, and storage, alleviate data throughput bottlenecks in AI computing clusters, and support distributed AI computing topology architectures.

core characteristics
1. High-speed SerDes transmission: Self-developed SerDes IP supports a maximum single-channel transmission rate of 32Gbps. The product is planned to cover PCIe 4.0/5.0 and is compatible with the CXL 2.0 protocol, enabling high-speed data interoperability between computing nodes and between computing power and storage.
2. Link Signal Compensation: Inheriting Longxun's mature signal relay and jitter compensation technologies, it repairs high-speed signal loss, improves the stability margin of high-speed interfaces, and reduces the difficulty of server system design in complex environments such as server backplanes and long cabling.
3. Heterogeneous computing power interconnection: Supports distributed computing power architecture, enables efficient data interaction between multiple GPUs and heterogeneous computing units, reduces data transfer latency, and improves the overall computing power utilization rate of large model training and inference clusters.
4. Localization solution: Domestically independently developed high-speed interconnect IP to fill the gap in domestically produced PCIe/CXL high-speed relay chips and achieve domestic substitution for high-end scenarios such as AI servers, HPC computing nodes, and 5G base stations.

Typical application scenarios
AI training servers, AI inference clusters, high-performance computing (HPC), storage servers, edge AI computing boxes, and automotive domain control AI computing platforms.

III. Technological Commonalities and Product Value
Longxun Interconnect chips are based on a high-speed mixed-signal circuit design platform. Both high-speed signal interconnect and AI interconnect chips share the common advantages of high integration, low power consumption, and strong signal integrity:

1. Unify the SerDes technology foundation and reuse years of technological accumulation in the field of video interconnection to the computing power interconnection track;
2. Supports flexible topology configuration, allowing customers to build signal relay, signal exchange, and computing power interconnection links according to system requirements;
3. Comprehensive hardware and software support, including reference schematic diagrams, PCB design guidelines, and debugging tools, shortens the customer's product development cycle.